Hefei Accuracy Intelligent Equipment Co., Ltd. is a national high-tech enterprise and a science and technology-based small and medium-sized enterprise specializing in "ultra-precision subtraction" and "high-reliability bonding" process equipment in the semiconductor packaging field. It integrates R&D, manufacturing, sales and service. The company is committed to building an independently controllable and technologically leading packaging equipment platform, and promoting the domestic upgrading of packaging process equipment.　　

　　The company's headquarters is located in Hefei, with branches in Changsha and Shenzhen, and service outlets in Beijing, Shanghai and Xi 'an. Its service network covers the major semiconductor industrial clusters across the country. The core technical team is led by senior experts in the industry, gathering R&D talents from multiple fields such as precision machinery, optical systems, motion control, image recognition, embedded software, and ultrasonic control, and possessing complete system design and on-site delivery capabilities.

　　The company now has two core product lines: dicing machines and bonding machines, comprehensively covering the key process links of "precision cutting + wire bonding" in the post-processing of semiconductor packaging: The dicing machine product line includes semi-automatic and fully automatic models ranging from 6 to 12 inches, suitable for fields such as IC, optoelectronics, sensors, and discrete devic.