Corporate Honors

  • High-tech enterprise
  • Small and medium-sized enterprises of science and technology
  • First Prize of Hunan Science Progress Award
  • China Machinery Industry Science and Technology Award first prize
  • China Machinery Industry Science and Technology Award second prize

Invention Patent

  • A wafer dicing saw
  • The utility model relates to a grinding wheel dicing saw for wafer processing with multi-station syn
  • The utility model relates to an automatic loading and unloading dual-axis grinding wheel dicing saw
  • The invention relates to a semiconductor wafer processing and dicing saw
  • The utility model relates to a frequency converter device for a wafer dicing saw
  • The utility model relates to a DC permanent magnet synchronous motor for wafer dicing
  • The invention relates to a spindle device for wafer dicing
  • The utility model relates to a cooling filter circulation device for a dicing saw
  • The invention relates to a pusher device for a semiconductor wafer dicing saw
  • The utility model relates to a manipulator clamping device for a semiconductor wafer dicing saw
  • The utility model relates to a continuously rotating dicing saw table
  • The utility model relates to a multi-blade dicing saw spindle
  • The utility model relates to a multi-layer movable dicing saw fixture

Software Copyright

  • 12-inch semiconductor wafer dicing saw visual inspection display system
  • 6-inch semiconductor wafer dicing saw parametric configuration terminal system
  • 6-inch semiconductor wafer dicing saw off-line control operation and maintenance system
  • NTC automatic dicing control system
  • Automatic precision dicing saw software
  • Automatic precision dicing saw control software