Packaging process - Wafer dicing process and optimization
Figure 1 D1, D2 represent the portion of the dicing block that remains intact, and FSC refers to the size of the front collapse. According to the packaging process design rules, the minimum value of D1 and D2 can be 0, and the width of the area where the collapse Angle is allowed is (block width - knife mark width)/2, which is the average value of D1 and D2, and the variance of D1 and D2.
2023-08-01 READ MORE
