The company provides processing services, equipped with a professional process development technical team, with more than 1000m clean workshop, can cut products including: all kinds of IC, PCB,OFN, ceramic substrate, optical glass, lithium niobate, bismuth antimonide, chip capacitor and resistor, silicon carbide, gallium nitride semiconductor devices and chips, etc. At present, more than 50 kinds of materials and thousands of product cutting process databases have been accumulated in the field of pan-semiconductor, which can provide customers with efficient and high-quality dicing foundry services.
