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12-inch dual-axis automatic wafer dicing saw

SD1222S

A 12-inch dual-axis fully automatic wafer dicing saw that automates wafer loading, alignment, dicing, cleaning, degluing and unloading. Equipped with high-power opposite type imported dual spindle, software independent design, high degree of automation, can meet customer's various processing needs, to provide customers with efficient, high-quality, low-cost dicing experience.

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Product Function

Dicing, cleaning and degluing integrated；
Multiple plates with double cutter dicing, can be customized work table；

Double power double light machine vision；
Automatic alignment, automatic knife mark detection function；

Multiple dicing modes: one-way/two-way, automatic/semi-automatic；
Layer dicing: Slot/cut；

Various automatic alignment algorithms can be selected to adapt to different processes；

Workpiece shape detection function；

Data scan entry function；

High precision non-contact height measurement；

Knife damage detection function；
Online knife sharpening function；

Product Characteristics

Fully automated wafer loading, alignment, dicing, cleaning, degluing and degluing.；

Equipped with high-precision and high-stability motion platform.；

Equipped with high rigidity linear motor motion platform.；

Equipped with high power opposite dual spindle.；

Equipment parameters

Equipment model：SD1222S
Work panel size	Twelve inches/300*300mm Square panel
Maximum dicing thickness	≤4mm or Customization
X-axis	Y-axis
Control system：Linear motor+Grating closed loop system	Control system：Linear motor+Grating closed loop system
Maximum stroke(mm)：550	Maximum stroke(mm)：480
Eﬀective dicing stroke(mm)：350	Eﬀective dicing stroke(mm)：350
Resolution(mm)：0.0001	Resolution(mm)：0.0001
Dicing speed(mm/s)：0.1~600	Single step positioning accuracy(mm)：0.001
Z1/Z2 axis	θ-axis
Control system：step-by-step	Driving mode：Direct driver
Maximum stroke(mm)：45	Rotation angle(°)：380(-100~280)
Maximum applicable blade(mm)：Φ58	Rotational speed(°/s)：5
Resolution(mm)：0.0002	Resolution(°)：0.0005
Repeated positioning accuracy(mm)：0.001
Principal Axis	Visual System
Power(kW)：2.4	Compose：Light source/Lens/Camera
Rotational speed(rpm)：10000~60000	Capabilities：High precision/Fast speed/Accurate positioning
	High/low power combination option: 0.8X/1X/1.5X/3X/6X dual lens option

Equipment size WDH(mm)	120017001850
Weight(kg)	about 2050
Power supply(V)	Single phase AC220V±10% 8kVA

Product Application

Semiconductor compound materials
Silicon carbide
Gallium arsenide
Graphite substrate
Aluminum nitride wafer
Silicon based wafer

Operating Environment Requirements

Ambient temperature
Install the machine in a clean room environment with a temperature of 20 to 25°C(fluctuation range +1), relative humidity of 40 to 60%, no condensation, no strong magnetic field, no corrosive gas, and no obvious vibration, and avoid installation near blowers, vents, and equipment that produces high temperature and oil mist.；

Compressed air
The oil content of the air source is less than 0.5mg/m3, and the filtration degree is more than 0.01um/99.5%. The air pressure is 0.5-0.6MPa.；

dicing water
The water pressure is 0.2-0.4MPa, the water temperature is controlled at room temperature ±2°C, and the process with special requirements for dicing water is provided according to the actual requirements.；

Cooling water
The quality of the main shaft cooling water directly affects the accuracy and stability of the main shaft, requiring the main shaft cooling water to be clean and free of impurities, it is recommended to use a pure water machine circulation water supply, water temperature control at room temperature soil 2°C, pressure 0.2-0.4MPa.；

中文

12-inch dual-axis automatic wafer dicing saw

Wechat Official Account

Tiktok Official Account

Telephone：

0551-63860654

Address：

Building 2, Hupu Industrial Park, No.4715 Wangjiang West Road.High-tech Zone, Hefei City,Anhui Province

Email：

acc-psm@hfakrs.com