From April 9 to April 11, 2024, the 12th China Electronic Information Expo (hereinafter referred to as the "Fair") was held in Shenzhen Convention and Exhibition Center (Futian). Accuracy with its SD612, SD1222 series precision scribbling machine appeared at this exhibition, and many leading manufacturers and service providers in the industry gathered together to share the development trend and cutting-edge scientific and technological achievements of the semiconductor industry.
　　
　　As one of the largest and most internationally influential electronic information industry events in China, the Expo has set up the CITE brand innovation theme Pavilion, Digital Trade Ecological Pavilion, basic electronics Pavilion, electronic information industry application Pavilion and other pavilions with the theme of "Pursuing excellence, Creating the Future through number". Focusing on high-end semiconductors, innovation, big data and storage, artificial intelligence, smart home, new display and other industry hot spots, attracted more than 1,500 well-known brands and industry giants from around the world to participate in the same period held more than 50 professional activities, on-site exhibitors more than 100,000 people. 　　As an enterprise specializing in the research and development, production, sales and service integration of pan-semiconductor ultra-precision grinding special processing equipment, Accuracy has been deeply engaged in ultra-precision grinding technology for many years, combined with semiconductor packaging process technology, and continues to provide customers with fully autonomous and controllable ultra-precision special processing equipment/process/tools and overall solutions. The debut of SD612, SD1222 series precision cutting machine, high precision, durability, high stability, performance comparable to international standards, widely used in silicon, ceramics, glass, PCBA, composite materials, metals and other hard and brittle materials precision cutting processing.
　　
　　During the three-day exhibition, the booth was crowded with new and old customers at home and abroad, who showed great interest in the products of Accuracy Customers stopped to exchange, in-depth communication and consultation with our showroom staff related to product technology issues, and jointly explore new business opportunities and cooperation opportunities. 　　At the time of the exhibition, Accuracy Shenzhen office officially opened! Mr. Gong Sheng, general manager of our company, led the staff of the headquarters and offices to hold a lively unveiling ceremony and opening ceremony. As a pioneer of China's reform and opening up and one of the four major central cities in the Guangdong-Hong Kong-Macao Greater Bay Area, Shenzhen has a unique geographical location and superior industrial base, which is an indispensable part of the business expansion journey of Accuracy.
　　
　　The Shenzhen office is equipped with a professional sales team and technical support team, which can provide a full range of products from pre-sale to after-sales service. In the next step, the Shenzhen office will take Shenzhen as the regional center, radiate the customer base in South China, and write a new chapter for the national business development. We also welcome new and old customers to visit us! Akaris is looking forward to developing together with you!
　　Dicing saw has always been an important equipment in the semiconductor packaging link, with the continuous improvement of China's localization technology, the trend of localization replacement is gradually clear, Accuracy is one of the main forces to help the domestic equipment industry gradually develop and grow. Since its establishment, our company has deeply cultivated ultra-precision grinding technology, lived up to the expectations, and continuously achieved phased results, and continued to help the development of semiconductor precision grinding technology to reach a peak.
　　

　　In the future, Accuracy will continue to adhere to the corporate philosophy of "customer demand as the center and technological innovation as the driver", continue to innovate and forge ahead, join hands with more industry partners, and contribute more wisdom and strength to the future of the semiconductor industry.